Manufacturing method for fixing tin balls in connectors or IC devices

ABSTRACT

A method for fixing tin balls in one of a connector or an IC device to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be welded to the tin balls of the ball grid array seat; the method comprising the steps of: selecting a ball grid array seat; covering a bottom of the ball has a mold by a mold plate having a plurality of recesses; filling the tin glue into the recesses of the mold plate so that the tin glue exactly encloses the welding portions of the terminals; taking out the mold plate; and melting the tin glue so as to condense as a balls or ball-like tin balls, so that condensed tin balls are combined to the welding portions. Moreover, the mold plate can be removed in manufacturing the tin balls.

BACKGROUND OF THE INVENTION

[0001] (a) Field of the Invention

[0002] The present invention relates to tin balls of ball grid array seat, and particularly to manufacturing method for fixing tin balls in one of a connector or an IC device.

[0003] (b) Description of the Prior Art

[0004] Conventionally, electric connectors, CPUs, chips, zero insertion electric connector or electric elements are welded to a circuit board. A plurality of terminals embedding holes are punched on a circuit board for embedding a plurality of terminals. Then the terminals are welded and fixed by tin material. This way is not preferred for terminals with a larger number of pins and with slender pins. Therefore, it is not adapted in the current electronic technology. To improve the defects in the prior art, the bottom of the terminals are combined with tin balls which are then welded to a circuit board.

[0005] However, the tin balls are adhered to a circuit board by various ways, for example, the welding portion of a terminal is formed with two copper clips or FIGS. 10 and 11, the welding portion 101 of a terminal 10 is formed as a plane and welding assisting agent 102 is sued in welding (referring to FIG. 12). Therefore, the manufacturer must prepare several producing lines for these tedious works so that the costs in manufacturing and repair are high. Moreover, the forms of the terminals are fixed and can not be designed as desired.

[0006] For the manufacturing method that the plan welding portion of a terminal 10 is combined with melted tin ball 20 using welding assisting agent (referring to FIGS. 10 and 11), the welding portion 101 of the terminal 10 has a plane structure so that the welding assisting agent can be printed upon the welding portion 101. If the welding portion has a needle shape or an embedded shape, the welding portion is not suitable for printing the welding assistant agent. Therefore, the prior art is not a preferred way and can not be used in various terminal structure.

SUMMARY OF THE INVENTION

[0007] Thereby, the primary object of the present invention is to provide a method for fixing tin balls in one of a connector or an IC device to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be welded to the tin balls of the ball grid array seat; the method comprising the steps of: (a) selecting a ball grid array seat, wherein an internal of the ball grid array seat has been embedded with terminals and a bottom of each terminal has a terminal welding portion; (b) covering a bottom of the ball has a mold by a mold plate having a plurality of recesses; the mold plate being formed with respect to the welding portions of the terminal; (c) filling the tin glue into the recesses of the mold plate so that the tin glue exactly encloses the welding portions of the terminals; (d) taking out the mold plate so that the tin glue is left in the welding portions of the terminals; and (e) melting the tin glue so as to condense as a balls or ball-like tin balls, so that condensed tin balls are combined to the welding portions at the lower ends of the terminals of the ball grid array seat.

[0008] Another object of the present invention is to provide a A method for fixing tin balls in one of a connector or an IC device to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be welded to the tin balls of the ball grid array seat; the method comprising the steps of: (a) selecting a ball grid array seat, wherein an internal of the ball grid array seat has been embedded with terminals and a bottom of each terminal has a terminal welding portion; (b) filling tin glue into the recesses so that the tin glue exactly encloses the welding portions of the terminals; and (c) melting the tin glue so as to condense as a balls or ball-like tin balls, so that condensed tin balls is combined to the welding portions at the lower ends of the terminals of the ball grid array seat.

[0009] The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010]FIG. 1 is a schematic view about the ball grid array seat and the terminals of the present invention.

[0011]FIG. 2 is a schematic view showing that the use of the mold plate in the present invention.

[0012]FIG. 3A is a schematic view showing the tin glue being coated in the recesses according to present invention.

[0013]FIG. 3B is a schematic view showing the tin glue being extruded into the recesses according to the present invention.

[0014]FIG. 3C is a schematic view showing the tin glue being injected into the recesses according to the present invention.

[0015]FIG. 4 is a schematic view showing the tin glue of the present invention in that the mold plate is taken down.

[0016]FIG. 5 is a schematic view showing that in the present invention, the tin glue is melt.

[0017]FIG. 6 is a schematic view showing the tin balls of the ball grid array seat according to the present invention.

[0018]FIG. 7 is a schematic view showing another embodiment about the manufacturing method of the present invention.

[0019]FIG. 8 is a schematic view showing another embodiment in the manufacturing method of the present invention.

[0020]FIG. 9 is a schematic view includes the welding portions of the present invention is embedded.

[0021]FIG. 10 is a schematic view showing that the welding assisting agent is coated upon a terminal.

[0022]FIG. 11 is a schematic view showing a prior art tin ball being welded to a terminal.

[0023]FIG. 12 is a schematic view showing that in the prior art, a terminal is welded to a circuit board.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Referring to Figures, the electric connector and IC tin ball fixing manufacturing method of the present invention is illustrated. The present invention can be used to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be welded to the tin balls of the ball grid array seat 1. The manufacturing method will be described herein:

[0025] (a) Select a ball grid array seat 1 (referring to FIG. 1), the internal of the ball grid array seat 1 has been embedded with terminals 2 and the bottom thereof has a terminal welding portion 21. The ball grid array seat 1 can be the bottom component of one of an electric connector, IC or other electronic elements.

[0026] (b) A bottom of the ball has a mold is covered by a mold plate 3 having a plurality of recesses 31. The mold plate 3 is formed with respect to the welding portion 21 of the terminal 2.

[0027] (c) The tin glue 4 is filled into the recesses 31 of the mold plate 3 so that the tin glue 4 exactly encloses the welding portions 21 of the terminals 2; the tin glue 4 is coated upon the recesses 31 of the mold plate 3 (referring to FIG. 3A), or the tin glue 4 is extruded into the recesses 31 of the mold plate 3 (referring to FIG. 3B); or the tin glue 4 is injected into the recesses 31 of the mold plate 3 (referring to FIG. 3B).

[0028] (d) The mold plate 3 is taken out so that the tin glue 4 is left in the welding portions 21 of the terminals 2 (referring to FIG. 4).

[0029] (e) The tin glue 4 is melted so as to condense as a balls or ball-like tin balls 4′, so that condensed tin balls 4′ are combined to the welding portions 21 at the lower ends of the terminals 2 of the ball grid array seat 1 (referring to FIGS. 5 and 6).

[0030] By above said connector and IC tin balls fixing manufacturing method, the welding portions 21 at bottoms of the connectors or IC or other electronic elements are welded with tin balls 4 so as to weld a circuit board. Since in the present invention, the tin glue 4 encloses the welding portions 21 at the lower end of the terminals 2 of the ball grid array seat 1. Thereby, despite that the shape of the welding portions 21 has plane shapes, piece shapes, needles and embedding shapes, etc. (referring to FIG. 9), the tin glue 4 can enclose the welding portions 21 and then hot melting way is used to cause the tin ball 4 to melt and then is condensed as tin balls 4′.

[0031] By the method of the present invention, a plurality of welding portions 21 can be used in one producing line. Thereby, the present invention provides a low cost manufacturing method with a high quality. The defects in the prior art are avoided.

[0032] By the method of the present invention that the tin film 3 is melted as tin liquid to enclose the welding portions 21 at the lower end of the terminal 2 of the ball grid array seat 1 of an electric connector, IC or electric elements, the way for fixing tin balls is not confined. By the present invention, the terminal 2 and ball grid array seat 1 may be a preferred combining way.

[0033] In the present invention, the electric connector and IC tin ball fixing manufacturing method, the tin ball 4 is melted upon the terminals 2 of the ball grid array seat 1. However, other method can be used rather than above said method of using mold plate 3. The method can be applied to the ball grid array seat 1 of the connector 1 or IC. The method comprises the following steps.

[0034] (a) Select a ball grid array seat 1, the internal of the ball grid array seat 1 has been embedded with terminals 2 and the bottom thereof has a terminal welding portion 21. One the ball grid array seat 1 has a plurality of recesses 11 around the ball grid array seat 1 (referring to FIG. 7), each recess 31 can be formed with piece-like welding portions 21 (referring to FIG. 8).

[0035] (b) The tin glue 4 is filled into the recesses 11 so that the tin glue 4 exactly encloses the welding portions 21 of the terminals 2; the tin glue 4 is coated upon the recesses 11, or the tin glue 4 is extruded into the recesses 11; or the tin glue 4 is injected into the recesses 11 of the mold plate 3.

[0036] (c) The tin glue 4 is melted so as to condense as a balls or ball-like tin balls 4′, so that condensed tin balls 4′ is combined to the welding portions 21 at the lower ends of the terminals 2 of the ball grid array seat 1 (referring to FIG. 8).

[0037] In above manufacturing method, the tin glue 4 can enclose the welding portions 21 of the terminals 2 of the ball grid array seat 1 of a connector or IC. Thereby, any form of the welding portion 21 can be used in the present invention.

[0038] The present invention is thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims. 

1. A method for fixing tin balls in one of a connector or an IC device to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be welded to the tin balls of the ball grid array seat; the method comprising the steps of: (a) selecting a ball grid array seat, wherein an internal of the ball grid array seat has been embedded with terminals and a bottom of each terminal has a terminal welding portion; (b) covering a bottom of the ball has a mold by a mold plate having a plurality of recesses; the mold plate being formed with respect to the welding portions of the terminal; (c) filling the tin glue into the recesses of the mold plate so that the tin glue exactly encloses the welding portions of the terminals; (d) taking out the mold plate so that the tin glue is left in the welding portions of the terminals; and (e) melting the tin glue so as to condense as a balls or ball-like tin balls, so that condensed tin balls are combined to the welding portions at the lower ends of the terminals of the ball grid array seat.
 2. The manufacturing method for fixing tin balls in one of a connector or an IC device as claimed in claim 1, wherein the tin glue being coated upon the recesses of the mold plate.
 3. The manufacturing method for fixing tin balls in one of a connector or an IC device as claimed in claim 1, wherein the tin glue is extruded into the recesses of the mold plate.
 4. The manufacturing method for fixing tin balls in one of a connector or an IC device as claimed in claim 1, wherein the tin glue is injected into the recesses of the mold plate.
 5. A method for fixing tin balls in one of a connector or an IC device to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be welded to the tin balls of the ball grid array seat; the method comprising the steps of: (a) selecting a ball grid array seat, wherein an internal of the ball grid array seat has been embedded with terminals and a bottom of each terminal has a terminal welding portion; (b) filling tin glue into the recesses so that the tin glue exactly encloses the welding portions of the terminals; and (c) melting the tin glue so as to condense as a balls or ball-like tin balls, so that condensed tin balls is combined to the welding portions at the lower ends of the terminals of the ball grid array seat.
 6. The manufacturing method for fixing tin balls in one of a connector or an IC device as claimed in claim 5, wherein the tin glue being coated upon the recesses of the mold plate.
 7. The manufacturing method for fixing tin balls in one of a connector or an IC device as claimed in claim 5, wherein the tin glue is extruded into the recesses of the mold plate.
 8. The manufacturing method for fixing tin balls in one of a connector or an IC device as claimed in claim 5, wherein the tin glue is injected into the recesses of the mold plate. 